Application collection

Conduct Heat While Maintaining Electrical Insulation

Adds thermal-conductivity and dielectric-filler options for interfaces, adhesives, potting compounds, overmolding and insulating composites.

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Conduct Heat While Maintaining Electrical Insulation

3
Name CAS No. Function & Usage RFQ
Aluminum Nitride (AlN)
24304-00-5
Increases heat-transfer capability while supporting electrical insulation in compatible resin, adhesive and polymer systems. Typical uses: Thermally conductive epoxy and silicone compounds, Electronic substrates and ceramics, Potting and gap-filler systems.
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Hexagonal Boron Nitride (hBN)
10043-11-5
Increases heat-transfer capability while supporting electrical insulation in compatible resin, adhesive and polymer systems. Typical uses: Thermal interface materials, Electronic potting and overmolding, Thermally conductive adhesives.
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Spherical Fused Silica
60676-86-0
Increases heat-transfer capability while supporting electrical insulation in compatible resin, adhesive and polymer systems. Typical uses: Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates.
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