693-98-1
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Epoxy cure acceleration, Electronic encapsulation compounds, Powder coatings.
Application collection
Build Laminates & Protect Copper
Connects laminate, copper-protection, low-CTE and curing materials for PCB and electrical-insulation formulation work.
Build Laminates & Protect Copper
5
Name
CAS No.
Function & Usage
RFQ
670-96-2
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.
35948-25-5
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Halogen-free epoxy and laminate systems, Copper-clad laminates, Electronic encapsulation resins.
461-58-5
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives.
60676-86-0
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates.
Safety note
Confirm technical and safety data before ordering
Website information supports initial product discovery. Final specifications, hazard classification, transport conditions and storage requirements must be confirmed by the latest grade-specific SDS, COA and destination-market regulations.