Product overview
2-Phenylimidazole is a functional material evaluated for Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation. Suitability for electrical or electronic use depends on the exact grade, impurity profile, particle-size or cure data, application testing and destination-market requirements.
Function & Usage
- Encapsulate, Pot & Electrically Insulate
Supports potting, casting, molding or encapsulation systems used to protect and electrically insulate components. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.
- Cure & Accelerate Electronic Epoxy Systems
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.
- Build Laminates & Protect Copper
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.
Product information
- Primary category:
- Electronics & Electrical Materials, Paints, Coatings, Adhesives & Construction, Fine Chemicals
- Subcategory:
- Epoxy Accelerators & Catalysts
- CAS No.:
- 670-96-2
- Form:
- White to pale yellow crystalline powder
- Content / Grade:
- Epoxy accelerator grade; assay ≥98.0% or ≥99.0% typical
- Applications:
- Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation, Heat-resistant adhesives
- Hazard / Transport:
- Reactive epoxy-curing material. Harmful, corrosive, serious-eye-damage or sensitization classifications may apply depending on the substance. Avoid dust, vapor and direct contact and confirm transport status from the latest grade-specific SDS.
- Storage:
- Store tightly closed in a cool, dry and well-ventilated place. Protect from moisture, heat, direct sunlight, acids and oxidizing agents; prevent contamination that could trigger unintended resin curing.