Cure & Accelerate Electronic Epoxy Systems

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Fast epoxy cure acceleration, Electrical casting and potting, Electronic adhesives.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Epoxy cure acceleration, Electronic encapsulation compounds, Powder coatings.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Epoxy coatings and casting compounds, Electrical impregnation and encapsulation, Electronic and integrated-circuit packaging.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: High-temperature epoxy casting, Electrical insulation and potting, Encapsulation resins.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Low-viscosity epoxy curing systems, Electrical impregnation and casting, Semiconductor and electronic encapsulation.

Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Electrical potting and casting, Epoxy encapsulation, Insulation varnish and composites.